Often it is troublesome to cool diverse components like memory chips, CPUs, MCUs, DSPs and other ICs densely packed. Different heights prevent a proper contact to the heatsink and thus make it useless. The thermal pad is perfect to close even large spaces completely. Due to its low hardness this silicon pad adapts ideally to uneven surfaces, also at low pressure and thus ensures the best possible heat dissipation. In the comparison test the Thermal Pad with its special filler and a high thermal conductivity can demonstrate its performance and leaves the competitors behind.
from techPowerUp! http://ift.tt/1KhINuE
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