Samsung Electronics Co., Ltd., announced today that it is mass producing the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung's introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company's new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens the door for ultra-high capacity memory at the enterprise level. Samsung's new TSV DRAM module boasts the largest capacity and the highest energy efficiency of any DRAM modules today, while operating at high speed and demonstrating excellent reliability.
"We are pleased that volume production of our high speed, low-power 128GB TSV DRAM module will enable our global IT customers and partners to launch a new generation of enterprise solutions with dramatically improved efficiency and scalability for their investment," said Joo Sun Choi, executive vice president, Memory Sales and Marketing, Samsung Electronics. "We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets, where consumers can benefit from innovative technology that enhances their productivity and the overall user experience."
from techPowerUp! http://ift.tt/1R7IbtU
via Techpowerup is my favorite place to get more review and the computer hardware part review, the review and the news is just so good, i really recommend you to visit the original page to read the full story about what the news beast and what the site talking about, enjoy the computer hardware part information online, visa techpowerup, i hope someday i will easily buying the new list item on the review list, just to make very beast computer rig, to encode the x264, that will kicking some ass... be ready
Post a Comment
This blog needed you to understand the word spam - never spam on this blog, although i will not moderate all of it, but you will learn it yourself, educate yourself